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tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 tmp006/b infrared thermopile sensor in chip-scale package 1 features 3 description the tmp006 and TMP006B are fully integrated 1 ? integrated mems thermopile for noncontact mems thermopile sensors that measure the temperature sensing temperature of an object without having to be in direct ? local temperature sensor for cold junction contact. the thermopile absorbs passive infrared reference energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view. ? 1 c (max) from 0 c to 60 c ? 1.5 c (max) from ? 40 c to +125 c the corresponding change in voltage across the thermopile is digitized and reported with the on-chip ? two-wire serial interface options: die thermal sensor measurement through an i 2 c- and ? i 2 c and smbus compatible smbus-compatible interface. with this data, the ? tmp006 at 3.3 v target object temperature can be calculated by an external processor. ? TMP006B at 1.8 v ? eight programmable addresses the tmp007 is an enhanced version of the tmp006 or TMP006B. the tmp007 combines all the features ? low power of the tmp006 and TMP006B with an additional math ? supply: 2.2 v to 5.5 v engine to perform all of the equations on chip, ? active current: 240 a (typ) allowing the target object temperature to be read directly from the device. the tmp007 also provides ? 1- a shutdown (max) built-in nonvolatile memory for storing calibration ? compact package coefficients. ? 1.6-mm 1.6-mm 0.625-mm dsbga the infrared thermopile sensor is specified to operate from ? 40 c to +125 c. it is possible to measure an 2 applications object temperature beyond the device operating ? noncontact temperature sensing range as long as the device itself does not exceed the operating temperature range ( ? 40 c to +125 c). ? case temperature ? laser printers device information (1) ? power relays part number package body size (nom) ? health and beauty tmp006 dsbga (8) 1.60 mm 1.60 mm ? hvac comfort optimization TMP006B ? gas concentration (1) for all available packages, see the package option addendum at the end of the datasheet. ? flame detection simplified schematic 1 an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. 16-bit '6 adc gain die temperature ir thermopile sensor voltage reference sensor amplifier digital control two-wire interface drdy adr0 adr1 scl sda v+ agnd dgnd tmp006 TMP006B t hot t cold t hot t hot t hot + productfolder sample &buy technical documents tools & software support &community
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com table of contents 8.5 register maps ......................................................... 19 1 features .................................................................. 1 9 application and implementation ........................ 21 2 applications ........................................................... 1 9.1 application information ............................................ 21 3 description ............................................................. 1 9.2 typical application ................................................. 21 4 revision history ..................................................... 2 9.3 system examples ................................................... 24 5 device comparison table ..................................... 4 10 power-supply recommendations ..................... 26 6 pin configuration and functions ......................... 4 11 layout ................................................................... 27 7 specifications ......................................................... 5 11.1 layout guidelines ................................................. 27 7.1 absolute maximum ratings ..................................... 5 11.2 layout examples ................................................... 28 7.2 esd ratings .............................................................. 5 12 device and documentation support ................. 31 7.3 recommended operating conditions ....................... 5 12.1 device support .................................................... 31 7.4 thermal information .................................................. 5 12.2 documentation support ........................................ 31 7.5 electrical characteristics .......................................... 6 12.3 related links ........................................................ 31 7.6 typical characteristics .............................................. 7 12.4 trademarks ........................................................... 31 8 detailed description .............................................. 8 12.5 electrostatic discharge caution ............................ 31 8.1 overview ................................................................... 8 12.6 glossary ................................................................ 31 8.2 functional block diagram ......................................... 8 13 mechanical, packaging, and orderable 8.3 feature description ................................................... 8 information ........................................................... 32 8.4 device functional modes ........................................ 19 4 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from revision d (november 2014) to revision e page ? changed feature , applications , and description sections .................................................................................................... 1 ? changed thermopile sensor portion of simplified schematic .................................................................................................. 1 ? changed operating range minimum value in absolute maximum ratings from ? 55 c to ? 40 c .......................................... 5 ? changed handling ratings to esd ratings and moved storage temperature to absolute maximum ratings ..................... 5 ? changed figure 3 .................................................................................................................................................................. 7 ? changed thermopile sensor portion of functional block diagram ........................................................................................... 8 ? deleted text at the end of 2nd paragraph in field of view and angular response section ................................................ 10 ? added figure 8 ..................................................................................................................................................................... 10 ? changed t reg to t die in temperature format section ........................................................................................................ 15 changes from revision c (december 2012) to revision d page ? changed all instances of wcsp to dsbga throughout data sheet ...................................................................................... 1 ? changed document format to latest data sheet standards .................................................................................................... 1 ? added device comparison , handling rating , and recommended operating conditions tables, and feature description , device functional modes , register maps , application and implementation , power supply recommendations , layout , device and documentation support , and mechanical, packaging, and orderable information sections ................................................................................................................................................................ 1 ? changed text in first paragraph of description section ......................................................................................................... 1 ? changed all instances of " local temperature " to " die temperature " throughout data sheet .................................................. 1 ? moved histogram from page 1 to typical characteristics section .......................................................................................... 1 ? added simplified schematic title to front-page figure ............................................................................................................ 1 ? changed simplified schematic ................................................................................................................................................ 1 ? deleted package information table ....................................................................................................................................... 4 ? changed all t object to t obj throughout data sheet .................................................................................................................. 6 ? changed x- and y-axis labels in figure 1 ............................................................................................................................... 7 2 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 ? changed text related to object temperature measurement in first paragraph of overview section ....................................... 8 ? changed table 3 .................................................................................................................................................................. 15 ? changed all v object to v sensor throughout datasheet ......................................................................................................... 19 ? deleted pointer register section .......................................................................................................................................... 19 ? changed sensor voltage register name to sensor voltage result register .................................................................... 19 ? changed t ambient to t die throughout data sheet ................................................................................................................. 19 changes from revision b (february 2012) to revision c page ? added TMP006B device to data sheet ................................................................................................................................... 1 ? changed package information table to include new TMP006B device with the tmp006, and show the different voltage for the two devices ..................................................................................................................................................... 4 changes from revision a (july 2011) to revision b page ? changed output error, calculate object temperature parameter test conditions in electrical characteristics table ............. 6 ? changed description of device id to 0067h in manufacturer and device id registers section ........................................... 20 ? changed ffh, reset value bits d2, d1, and d0 values in figure 18 .................................................................................. 20 ? changed figure 23 .............................................................................................................................................................. 28 ? changed figure 24 ............................................................................................................................................................... 29 ? changed figure 25 ............................................................................................................................................................... 30 changes from original (may, 2011) to revision a page ? added specifications for ambient temperature sensor parameter over 0 c to +60 c ........................................................... 6 ? revised table 4 .................................................................................................................................................................... 16 copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 3 product folder links: tmp006 TMP006B
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com 5 device comparison table two-wire product interface voltage tmp006 3.3 v TMP006B 1.8 v 6 pin configuration and functions yzf package 8-pin dsbga (top view, not to scale) pin functions pin i/o description name no. adr0 c1 input address select pin adr1 b1 input address select pin agnd a2 power analog ground dgnd a1 power digital ground drdy c2 output data ready, active low, open-drain; requires a pullup resistor to v+. scl b3 input serial clock line for two-wire interface, open-drain; requires a pullup resistor to v+. sda c3 input/output serial data line for two-wire interface, open-drain; requires a pullup resistor to v+. v+ a3 power positive supply (2.2 v to 5.5 v) 4 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B c1 c3 c2 b1 b3 a1 a3 a2 sensor c b a 1 3 2 rows columns
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 7 specifications 7.1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) (1) min max unit supply voltage, v s v+ pin 7 v adr1 pins ? 0.5 v s + 0.5 v input voltage sda, scl, drdy, adr0 pins ? 0.5 +7 v input current 10 ma operating range ? 40 +125 c temperature junction temperature, t j max +150 c storage range, t stg ? 65 +150 c (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions . exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 esd ratings value unit human-body model (hbm), per ansi/esda/jedec js-001 (1) 2000 electrostatic v (esd) charged-device model (cdm), per jedec specification jesd22-c101 (2) 500 v discharge machine model 200 (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 7.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min nom max unit supply voltage, v s 2.5 3.3 5.5 v operating temperature range ? 40 +125 c die temperature, t die 125 c object temperature, t obj see note (1) c (1) object temperature is application dependent. 7.4 thermal information tmp006 TMP006B thermal metric (1) unit yzf (dsbga) 8 pins r ja junction-to-ambient thermal resistance 123.8 r jc(top) junction-to-case (top) thermal resistance 69 r jb junction-to-board thermal resistance 103 c/w jt junction-to-top characterization parameter 4.7 jb junction-to-board characterization parameter 55 r jc(bot) junction-to-case (bottom) thermal resistance n/a (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 5 product folder links: tmp006 TMP006B
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com 7.5 electrical characteristics at t die = +25 c, v+ = 3.3 v, and conversion time = 1 second, unless otherwise specified. parameter test conditions min typ max unit output error t die = 0 c to +60 c, v+ = 2.2 v to 5.5 v 0.5 1 c die temperature sensor t die = ? 40 c to +125 c, v+ = 2.2 v to 5.5 v 0.5 1.5 c psrr power-supply rejection ratio 0.1 c/v t die = +20 c to +60 c, calculate object temperature (1) 1 3 c t obj ? t die = ? 10 c to +30 c field of view 50% responsivity 90 degrees temperature measurement cr2 = 0, cr1 = 0, cr0 = 0 0.25 seconds cr2 = 0, cr1 = 0, cr0 = 1 0.5 seconds conversion time cr2 = 0, cr1 = 1, cr0 = 0 1 seconds cr2 = 0, cr1 = 1, cr0 = 1 2 seconds cr2 = 1, cr1 = 0, cr0 = 0 4 seconds die temperature sensor 0.03125 c resolution thermopile sensor resolution 156.25 nv smbus compatible interface tmp006 only 2.1 v v ih logic input high voltage (scl, sda) TMP006B only 1.4 v tmp006 only 0.8 v v il logic input low voltage (scl, sda) TMP006B only 0.4 v hysteresis 100 mv v ol output low voltage (sda) i out = 6 ma 0.15 0.4 v output low sink current (sda) 6 ma logic input current forced to 0.4 v ? 1 +1 a input capacitance (scl, sda, a0, a1) 3 pf clock frequency 0.001 3.4 mhz interface timeout 25 30 35 ms digital outputs v ol output low voltage ( drdy) i out = 4 ma 0.15 0.4 v i oh high-level output leakage current v out = v dd 0.1 1 a output low sink current ( drdy) forced to 0.4 v 4 ma power supply v s specified voltage range t die = ? 40 c to +125 c 2.2 5.5 v por power-on reset t die = ? 40 c to +125 c 1.6 v continuous conversion; see table 7 240 325 a serial bus inactive, shutdown mode, tmp006 0.5 1.0 a only i q quiescent current serial bus inactive, shutdown mode, TMP006B 1.5 5.0 a only serial bus active, f s = 400 khz, 90 a shutdown mode (1) this parameter is tested in a fully-settled setup with no transients, in front of an ideal black body, with specified layout constraints, and after system calibration. 6 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 7.6 typical characteristics at t die = +25 c and v s = 3.3 v, unless otherwise noted. figure 1. typical die temperature error figure 2. typical object temperature error t obj = 20 c, t die = 20 c, valid for 120 fov and object emissivity = 0.94 figure 4. noise-limited, object-temperature accuracy figure 3. responsivity vs angle copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 7 product folder links: tmp006 TMP006B 20 30 40 50 60 70 80 90 100 110 90 75 60 45 30 15 0 15 30 45 60 75 90 responsivity (%) angle ( ? ) c001 field of view 2015 10 50 - 3 3 t error ( c) obj count - 1 2 1 - 2 0 - s 3 +3 s 3 2.5 2 1.5 1 0.5 0 0.5 1 1.5 2 2.5 3 - - - - - - - 40 125 t die ( c) t error ( c) die - 25 5 50 65 35 20 80 - 10 95 110 3.3 v 5.5 v 2.2 v 43 2 1 0 1 2 3 4 -- - - - 20 40 t t ( c) - obj die t error ( c) obj 0 30 20 - 10 10 t = die 20 c t = die 40 c
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com 8 detailed description 8.1 overview the tmp006 and TMP006B are digital temperature sensors that are optimal for thermal management and thermal protection applications where remote noncontact sensing is desired. the tmp006 and TMP006B use a two-wire interface (i 2 c and smbus compatible), and are specified over the die temperature range of ? 40 c to +125 c. the tmp006 and TMP006B measure object temperatures over a range limited only by the maximum sensor voltage (5.12 mv). the tmp006 and TMP006B contain registers for holding configuration information, temperature measurement results, and sensor voltage measurement. die temperature and sensor voltage measurements are used to calculate the object temperature. the tmp006 and TMP006B provide both die temperature and thermopile sensor voltage outputs in a small dsbga chip-scale package. the die temperature sensor in both the tmp006 and TMP006B is integrated on- chip; the thermal path runs through the dsbga solder balls. the low thermal resistance of the solder balls provides the thermal path to maintain the chip at the temperature of the die environment. the top side of the dsbga package must face the object that is being measured with an unobstructed view in order to accurately measure the temperature. refer to the user guide tmp006 layout and assembly guidelines (sbou108) for more details. 8.2 functional block diagram 8.3 feature description the tmp006 and TMP006B sense the ir radiation emitted by all objects. the spectrum of the radiation depends only on the temperature and is given by planck ? s law, as shown in equation 1 : where ? h = planck ? s constant ? c = speed of light ? k b = boltzmann ? s constant ? = wavelength in microns (1) 8 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B ( ) 2 2 5 k t b 2hc 1 b t, watts / cm / m hc e 1 l ? ? ? ? l = m l ? l ? - ? 16-bit '6 adc gain die temperature ir thermopile sensor voltage reference sensor amplifier digital control two-wire interface drdy adr0 adr1 scl sda v+ agnd dgnd tmp006 TMP006B t hot t cold t hot t hot t hot +
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 feature description (continued) the intensity of radiation from the object is determined by the emisivity ( ), a material-dependent property that scales the spectral response so that 0 < < 1. for an ideal black body, the radiation is at a maximum for a given temperature and = 1. the temperature is measured on the kelvin scale where 0 k is absolute zero, or ? 273.15 c. room temperature (25 c) is approximately 298.13 k. the emission spectra for objects at or near room temperature are shown in figure 5 . for these temperatures, the majority of the radiation emitted is in the wavelength range of 3 m to 20 m. figure 5. black body emission spectrum and response 8.3.1 spectral responsivity the tmp006 and TMP006B are optimized to sense ir radiation emitted by objects from approximately 250 k ( ? 23 c) to 400 k (127 c), with maximum sensitivity from approximately 4 m to 16 m. the relative spectral response of the tmp006 and TMP006B is shown in figure 6 . figure 6. relative spectral response vs wavelength copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 9 product folder links: tmp006 TMP006B 0.0 0.2 0.4 0.6 0.8 1.0 1.2 4.0 8.0 12.0 16.0 relative response wavelength (m) c005 0.000 0.005 0.010 0.015 0.020 0.025 0 5 10 15 20 spectral radiant exitance (w/cm 2 /m) wavelength (m) 450 k 400 k 350 k 300 k 250 k c019 16 m 4 m
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com feature description (continued) 8.3.2 field of view and angular response the tmp006 and TMP006B sense all radiation within a defined field of view (fov). the fov (or full-angle of ) is defined as 2 . these devices contain no optical elements, and thus sense all radiation within the hemisphere to the front of the device. figure 3 shows the angular dependence of the sensor response and the relative power for a circular object that subtends a half angle of phi ( ). figure 7 defines the angle in terms of object diameter and distance. figure 7 assumes that the object is well approximated as a plane that is perpendicular to the sensor axis. figure 7. fov geometry definition in this case, the maximum contribution is from the portion of the object directly in front of the tmp006 or TMP006B ( = 0); with the sensitivity per solid angle, dr/d decreases as increases. approximately 50% of the energy sensed by the tmp006 and TMP006B is within a fov ( ) = 90 . this discussion is for illustrative purposes only; in practice the angular response (dr/d ) of the tmp006 and TMP006B to the object is affected by the object orientation, the number of objects, and the precise placement relative to the tmp006 or TMP006B. figure 8 shows the thermopile sensor dimensions. note: thermopile sensor is centered in the device. figure 8. thermopile sensor dimensions 10 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B sensor 1.6 mm 0.33 mm 0.33 mm 0.165 mm 0.165 mm 1.6 mm tmp006 object d - d sensor
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 feature description (continued) 8.3.3 thermopile principles and operation the tmp006 and TMP006B sense radiation by absorbing the radiation on a hot junction. the thermopile then generates a voltage proportional to the temperature difference between the hot junction, t hot , and the cold junction, t cold . figure 9. principle of thermopile operation the cold junction is thermally grounded to the die, and is effectively t die , the die temperature. in thermal equilibrium, the hot junction is determined by the object temperature, t obj . the energy emitted by the object, e obj , minus the energy radiated by the die, e die , determines the temperature of the hot junction. the output voltage, v out , is therefore determined by the relationship shown in equation 2 : where ? c is a constant depending on the design of the sensing element. (2) note that the sensor voltage is related to both the object temperature and the die temperature. a fundamental characteristic of all thermopiles is that they measure temperature differentials , not absolute temperatures. the tmp006 and TMP006B contain a highly-accurate, internal temperature sensing element to measure t die . estimate t obj by using v sensor and t die . for each 250-ms conversion cycle, the tmp006 and TMP006B measure a value for v sensor and for t die , which are then placed in their respective registers. for each conversion cycle, the device generates an analog-to-digital converter (adc) value for t die and v sensor . bits cr2 to cr0 determine the number of t die and sensor adc results to average before they are loaded into the respective registers for readout. after power-on reset (por), the tmp006 and TMP006B start in four conversions per second (cr[2:0] = 010). in general, for a mode with n conversions, the local temperature, t die , result is updated at the end of the nth adc conversion with the value shown in equation 3 : (3) similarly, the sensor voltage result is updated at the end of the nth sensor adc conversion with the value shown in equation 4 : (4) the total conversion time and averages per conversion can be optimized to select the best combination of update rate versus noise for an application. additionally, low-power conversion mode is available. in cr settings 101, 110, and 111, the device inserts a standby time before the beginning of the next conversion or conversions. the method and requirements for estimating t obj are described in the next section. copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 11 product folder links: tmp006 TMP006B n sensor x x 1 1 v sensor conversion n = = ? n die x x 1 1 t local temp conversion n = = ? out sensor hot cold obj die v v c (t t ) (t 4 t 4) = = - - thermopile heat absorbor cold junction t hot t cold t hot t hot t hot e hot ? t die 4 e obj ? t obj 4 +
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com feature description (continued) 8.3.4 object temperature calculation the tmp006 and TMP006B generate a sensor voltage, v sensor , in register 00h that is representative of the energy radiated by the object. in an ideal situation, the stefan-boltzman law relates the energy radiated by an object to its temperature by the relationship shown in equation 5 : where ? = stefan-boltzman constant = 5.7 10 -12 w/cm 2 /k 4 ? = emissivity, 0 < < 1, an object dependent factor, = 1 for a perfect black body (5) a similar relationship holds for the sensing element itself that radiates heat at a rate determined by t die . the net energy absorbed by the sensor is then given by the energy absorbed from the object minus the energy radiated by the sensor, as shown in equation 6 : (6) in an ideal situation, the sensor voltage relates to object temperature as shown in equation 7 : (7) where ? s is a system-dependent parameter incorporating the object emissivity ( ), fov, and sensor characteristics. the parameters s0, a1, and a2 are used in determining s. ? f(v obj ) is a function that compensates for heat flow other than radiation, such as convection and conduction, from nearby objects. the parameters b0, b1, and b2 are used to tune this function to a particular system and environment. (8) the coefficients affect object temperature measurement as described in table 1 . table 1. calibration coefficient definitions coefficient purpose calibration comment s0 fov and emissivity of object application and object default values based on black body with = 0.95, and dependent 110 fov a1, a2 device properties factory set default values based on typical sensor characteristics c device properties factory set default values based on typical sensor characteristics b0, b1, b2 corrects for energy sources environment dependent calibrate in end-application environment 12 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B { } 4 obj 4 obj die ? v t t s ? ? = + ? ? ? 4 4 sensor obj die v t t = + es ( ) 4 4 sensor absorbed radiated obj die v e e t t - = es - 4 rad obj energy t = es
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 8.3.5 calibration the tmp006 and TMP006B default coefficients are calibrated with a black body of emissivity, = 0.95, and an fov ( ) = 110 . use these coefficients for applications where the object emissivity and geometry satisfy these conditions. for applications with different object emissivity or geometry, calibrate the tmp006 or TMP006B to accurately reflect the object temperature and system geometry. accuracy is affected by device-to-device or object-to-object variation. for the most demanding applications, calibrate each device individually. as an overview the calibration procedure includes: 1. defining the environmental variation range (die and object temperature range, supply voltage, temperature change speed, sampling rate and so on). 2. making the die temperature measurements and ir sensor voltage measurements over the environmental range. 3. generate an optimal set of coefficients based on the collected data set. the best temperature precision is available if every device is calibrated individually. alternatively, if all the units in the application use the same coefficients, then calibrate a statistically significant number of devices. recalibration may be required under any or all of the following conditions: 1. board layout is changed. 2. object or objects in the field of view changed. 3. object distance changed. 4. angle between device surface and direction to the object changed. 5. object and local temperature range changed outside the environmental calibration range. 6. object and local temperature transients significantly changed. 7. supply voltage changed more than 1 v. 8. air convection or conduction near the device. for further information and methods for calibration, refer to user guide sbou142, tmp007 calibration guide copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 13 product folder links: tmp006 TMP006B
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com 8.3.6 sensor voltage format the tmp006 and TMP006B provide 16 bits of data in binary twos complement format. the positive full-scale input produces an output code of 7fffh and the negative full-scale input produces an output code of 8000h. the output clips at these codes for signals that exceed full-scale. table 2 summarizes the ideal output codes for different input signals. figure 10 illustrates code transitions versus input voltage. full-scale is a 5.12-mv signal. the lsb size is 156.25 nv. table 2. input signal versus ideal output code (1) sensor signal output code fs (2 15 ? 1)/2 15 (5.12 mv) 7fffh +fs/2 15 (156.25 nv) 0001h 0 0 ? fs/2 15 ( ? 156.25 nv) ffffh ? fs ( ? 5.12 mv) 8000h (1) fs = full-scale value. figure 10. code transition diagram 14 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B 7fffh output code - fs ? 0 ? fs sensor voltage (ain ain ) - p n 7ffeh 0001h ? 0000h8000h ffffh 8001h ? - fs 2 - 1 15 2 15 fs 2 - 1 15 2 15
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 8.3.7 temperature format the temperature register data format of the tmp006 and TMP006B is reported in a binary twos complement signed integer format, as table 3 shows, with 1 lsb = 1 / 32 c = 0.03125. table 3. temperature data format temperature ( c) digital output (binary) shifted hex 150 0100 1011 0000 0000 12c0 125 0011 1110 1000 0000 0fa0 100 0011 0010 0000 0000 0c80 80 0010 1000 0000 0000 0a00 75 0010 0101 1000 0000 0960 50 0001 1001 0000 0000 0640 25 0000 1100 1000 0000 0320 0.03125 0000 0000 0000 0100 0001 0 0000 0000 0000 0000 0000 ? 0.03125 1111 1111 1111 1100 ffff ? 0.0625 1111 1111 1111 1000 fffe ? 25 1111 0011 0111 0000 fcdc ? 40 1110 1011 1111 1100 faff ? 55 1110 0100 0111 1100 f91f converting the integer temperature result of the tmp006 and TMP006B to physical temperature is done by right- shifting the last two lsbs followed by a divide-by-32 of t die to obtain the physical temperature result in degrees celsius. t die is the 14-bit signed integer contained in the corresponding register. the sign of the temperature is the same as the sign of the integer read from the tmp006 and TMP006B. in twos complement notation, the msb is the sign bit. if the msb is 1, the integer is negative and the absolute value can be obtained by inverting all bits and adding 1. an alternative method of calculating the absolute value of negative integers is abs(i) = i xor ffffh + 1. 8.3.8 serial interface the tmp006 and TMP006B initially start up with typical settings consisting of a conversion rate of one conversion per second (as specified in the electrical characteristics ). the internal structure of the digital interface is shown in figure 11 . figure 11. internal structure copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 15 product folder links: tmp006 TMP006B pointer register result registers configuration registers i/o control interface scl sda drdy adr1 adr0
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com the tmp006 and TMP006B operate only as a slave device on the two-wire bus. connections to either bus are made via the open-drain i/o lines, sda, and scl. the sda and scl pins feature integrated spike-suppression filters and schmitt triggers to minimize the effects of input spikes and bus noise. the tmp006 and TMP006B support the transmission protocol for fast (1 khz to 400 khz) and high-speed (1 khz to 3.4 mhz) modes. all data bytes are transmitted msb first. 8.3.8.1 serial bus address to communicate with the tmp006 or TMP006B, the master must first address slave devices via a slave address byte. the slave address byte consists of seven address bits and a direction bit that indicates the intent to execute a read or write operation. the tmp006 and TMP006B feature two address pins to allow up to eight devices to be addressed on a single bus. table 4 describes the pin logic levels used to properly connect up to eight devices. the state of the adr0 and adr1 pins is sampled on every bus communication and should be set before any activity on the interface occurs. table 4. tmp006 and TMP006B address pins and slave addresses adr1 adr0 smbus address 0 0 1000000 0 1 1000001 0 sda 1000010 0 scl 1000011 1 0 1000100 1 1 1000101 1 sda 1000110 1 scl 1000111 8.3.8.2 read and write operations access a particular register on the tmp006 and TMP006B by writing the appropriate value to the pointer register. the pointer value is the first byte transferred after the slave address byte with the r/w bit low. every write operation to the tmp006 and TMP006B requires a value for the pointer (see figure 12 ). when reading from the tmp006 or TMP006B, the last value stored in the pointer by a write operation is used to determine which register is read by a read operation. to change the register pointer for a read operation, a new value must be written to the pointer. this transaction is accomplished by issuing a slave address byte with the r/w bit low, followed by the pointer byte. no additional data are required. the master can then generate a start condition and send the slave address byte with the r/w bit high to initiate the read command. if repeated reads from the same register are desired, it is not necessary to continually send the pointer bytes because the tmp006 and TMP006B retain the pointer value until it is changed by the next write operation. note that register bytes are sent msb first, followed by the lsb. 16 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 8.3.8.3 two-wire timing diagrams the tmp006 and TMP006B use a two-wire interface (i 2 c and smbus-compatible). figure 12 and figure 13 illustrate the timing for the various operations on the tmp006 and TMP006B. parameters for figure 12 are defined in table 5 . bus definitions are given below. table 5. two-wire timing diagram definitions fast mode high-speed mode parameter test conditions min max min max unit f scl scl operating frequency, v s > 1.7 v 0.001 0.4 0.001 3.4 mhz f scl scl operating frequency, v s < 1.7 v 0.001 0.4 0.001 2.75 mhz bus free time between stop and start t buf 600 160 ns condition hold time after repeated start condition. t hdsta after this period, the first clock is 100 100 ns generated. t susta repeated start condition setup time 100 100 ns t susto stop condition setup time 100 100 ns t hddat data hold time 0 (1) 0 (2) ns t sudat data setup time 100 10 ns t low scl clock low period, v s > 1.7 v 1300 160 ns t low scl clock low period, v s < 1.7 v 1300 200 ns t high scl clock high period 600 60 ns t f clock/data fall time 300 ns t r clock/data rise time 300 160 ns t r clock/data rise time for sclk 100 khz 1000 ns (1) for cases with fall time of scl less than 20 ns and/or the rise or fall time of sda less than 20 ns, the hold time should be greater than 20 ns. (2) for cases with a fall time of scl less than 10 ns and/or the rise or fall time of sda less than 10 ns, the hold time should be greater than 10 ns. bus idle: both sda and scl lines remain high. start data transfer: a change in the state of the sda line from high to low while the scl line is high defines a start condition. each data transfer is initiated with a start condition. stop data transfer: a change in the state of the sda line from low to high while the scl line is high defines a stop condition. each data transfer terminates with a stop or a repeated start condition. data transfer: the number of data bytes transferred between a start and a stop condition is not limited and is determined by the master device. the receiver acknowledges the transfer of data. acknowledge: each receiving device, when addressed, is obliged to generate an acknowledge bit. a device that acknowledges must pull down the sda line during the acknowledge clock pulse in such a way that the sda line is stable low during the high period of the acknowledge clock pulse. setup and hold times must be taken into account. on a master receive, data transfer termination can be signaled by the master generating a not- acknowledge on the last byte that has been transmitted by the slave. in order for the two-wire bus to operate at frequencies above 400 khz, the master device must issue a high- speed mode (hs-mode) master code (0000100x) as the first byte after a start condition to switch the bus to high-speed operation. the tmp006 and TMP006B do not acknowledge this byte, but switch the input filters on sda and scl and the output filter on sda to operate in hs-mode, allowing transfers at up to 3.4 mhz. after the hs-mode master code has been issued, the master transmits a two-wire slave address to initiate a data transfer operation. the bus continues to operate in hs-mode until a stop condition occurs on the bus. upon receiving the stop condition, the tmp006 and TMP006B switch the input and output filter back to fast-mode operation. copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 17 product folder links: tmp006 TMP006B
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com (1) slave address 1000000 shown. slave address changes for the tmp006 and TMP006B depend on the adr1 and adr0 pin connection. see table 4 for more details. figure 12. two-wire timing diagram for write word format (1) slave address 1000000 shown. (2) master must leave sda high to terminate a two-byte read operation. figure 13. two-wire timing diagram for two-byte read format 18 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B 1 start by master ack by device ack by device start by master ack by device ack by master from device 1 9 1 9 1 9 1 9 sda scl 0 0 0 r/ w p7 p6 p5 p4 p3 p2 p1 p0 sda scl (continued) sda scl 1 0 0 0 0 0 0 (1) 0 0 0 (1) r/ w d7 d6 d5 d4 d3 d2 d1 d0 stop by master nack by master (2) from device 1 9 d7 d6 d5 d4 d3 d2 d1 d0 frame 1 two-wire slave address byte frame 2 pointer register byte frame 3 two-wire slave address byte frame 4 msb frame 5 lsb 1 start by master ack by device ack by device ack by device stop by master 1 9 1 1 d7 d6 d5 d4 d3 d2 d1 d0 9 ack by device 1 d7 sda (continued) scl (continued) d6 d5 d4 d3 d2 d1 d0 9 9 sda scl 0 0 0 0 0 0 (1) r/ w p7 p6 p5 p4 p3 p2 p1 p0 ? ? frame 1 two-wire slave address byte frame 2 pointer register byte frame 4 lsb frame 3 msb
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 8.4 device functional modes the tmp006 and TMP006B operate in two modes: continuous and shutdown. a software reset function is also available. selecting the desired operating mode is done by writing to the configuration register conversion mode select bits mod[2:0]. the duration of the analog-to-digital (a/d) conversion is determined by the conversion rate bits cr[2:0] and is listed in table 7 . continuous mode, on the other hand, performs an a/d conversion followed by a low-power delay in order to reduce the average power consumption. multiple options for the conversion time and delay time are available in order to select the desired power and noise performance. initiating power-down has an immediate effect; it aborts the current conversion and puts the device into a low-power shutdown mode. rst, or software reset, is also immediate and initializes all memory locations with the respective reset values. 8.5 register maps the tmp006 and TMP006B contain data registers that hold configuration information, temperature measurement results, and status information. table 6. register map pointer (hex) register d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 00h sensor voltage v15 v14 v13 v12 v11 v10 v9 v8 v7 v6 v5 v4 v3 v2 v1 v0 01h local temperature t13 t12 t11 t10 t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 0 0 02h configuration rst mod3 mod2 mod1 cr3 cr2 cr1 en drdy 0 0 0 0 0 0 0 feh manufacturer id id15 id14 id13 id12 id11 id10 id9 id8 id7 id6 id5 id4 id3 id2 id1 id0 ffh device id id15 id14 id13 id12 id11 id10 id9 id8 id7 id6 id5 id4 id3 id2 id1 id0 8.5.1 sensor voltage result (v sensor ) register (address = 00h) [reset = 0000000000000000] the sensor voltage register is a 16-bit result register in binary twos complement format. one least significant bit (lsb) is 156.25 nv. the full-scale value is a 5.12 mv signal. data from this register ( figure 14 ) are used in conjunction with data from the temperature register to calculate the object temperature. figure 14 summarizes the sensor voltage register. the equation for the resultant object temperature is discussed in the tmp006 user guide (sbou107) . figure 14. sensor voltage result (v sensor ) register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 v15 v14 v13 v12 v11 v10 v9 v8 v7 v6 v5 v4 v3 v2 v1 v0 r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h legend: r/w = read/write; r = read only; -n = value after reset 8.5.2 temperature (t die ) register (address = 01h) [reset = 0000000000000000] the temperature register of the tmp006 and TMP006B is configured as a 14-bit, read-only register (as shown in figure 15 ) that stores the result of the most recent conversion for the die temperature, t die . following power-up or a software reset, the temperature register reads 0 c (0000h) until the first conversion is complete. figure 15. temperature (t die ) register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 t13 t12 t11 t10 t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ? r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h legend: r/w = read/write; r = read only; -n = value after reset 8.5.3 configuration register (address = 02h) [reset = 0111010000000000] figure 16 describes the configuration register. this register determines the operational modes, conversion rate, drdy control, initiates a single conversion, performs a software reset, or puts the device into shutdown mode. this register is read/write, and the pointer address is 02h. copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 19 product folder links: tmp006 TMP006B
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com figure 16. configuration register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 rst mod2 mod1 mod0 cr2 cr1 cr0 en drdy ? ? ? ? ? ? ? r/w- r/w- r/w- r/w- r/w- r/w- r/w- r/w- r/w- r/w- r/w- r/w- r/w- r/w- r/w- r/w- 0h 1h 1h 1h 0h 1h 0h 0h 0h 0h 0h 0h 0h 0h 0h 0h legend: r/w = read/write; r = read only; -n = value after reset bit [15] rst: software reset bit 0 = normal operation, this bit self clears 1 = software reset bits [14:12] mod[2:0]: mode of operation 000 = power-down 111 = sensor and die continuous conversion (mod) bits [11:9] cr[2:0]: adc conversion rate see table 7 . bit [8] en: drdy enable bit 0 = drdy pin disabled 1 = drdy pin enabled bit [7] drdy: data ready bit 0 = conversion in progress 1 = object voltage and ambient temperature results are ready to read. a temperature or sensor voltage read or a write to the configuration register is required to clear the condition. bits [6:0] unused [6:0] table 7. conversion rate total number of peak-peak noise conversion rate averaged average i q of the t obj result cr2 cr1 cr0 (conversions/sec) samples ( a) ( c) 0 0 0 4 1 240 0.5 0 0 1 2 2 240 0.35 0 1 0 1 4 240 0.25 (default) 0 1 1 0.5 8 240 0.18 1 0 0 0.25 16 240 0.125 8.5.4 manufacturer and device id registers the tmp006 and TMP006B have two identification registers: manufacturer id (address feh) shown in figure 17 , and device id (address ffh) shown in figure 18 . the manufacturer id reads 5449h and the device id is 0067h. 8.5.4.1 manufacturer id register (address = feh) [reset = 0101010001001001] figure 17. manufacturer id register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 id15 id14 id13 id12 id11 id10 id9 id8 id7 id6 id5 id4 id3 id2 id1 id0 r-0h r-1h r-0h r-1h r-0h r-1h r-0h r-0h r-0h r-1h r-0h r-0h r-1h r-0h r-0h r-1h legend: r/w = read/write; r = read only; -n = value after reset 8.5.4.2 device id register (address = ffh) [reset = 0000000001100111] figure 18. device id register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 id15 id14 id13 id12 id11 id10 id9 id8 id7 id6 id5 id4 id3 id2 id1 id0 r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-0h r-1h r-1h r-0h r-0h r-1h r-1h r-1h legend: r/w = read/write; r = read only; -n = value after reset 20 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 9 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 9.1 application information the tmp006 and TMP006B are a complete ir thermopile sensor system on a chip that includes the sensing element, signal conditioner, and adc. these devices are ideal for applications where the object cannot be placed in thermal contact with a conventional temperature sensor. common reasons for noncontact temperature sensing are: ? distance; the object is too far away, or in an inconvenient location for wired connections. ? the object is in motion. ? direct contact of the object is inconvenient or uncomfortable (for example, skin). ? the object is a fluid (that is, liquid or gas). ? the object is hazardous (for example, acid or flammable). ? the object is in a hazardous state (for example, high voltage). 9.2 typical application 9.2.1 wide-range calibration example: t obj = 0 c to 60 c, common vs unit calibration figure 19. typical application circuit copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 21 product folder links: tmp006 TMP006B adr1 scl sda agnd v+ drdy two-wire controller a3 b1 c2 b3 c3 a2 tmp006 2.5 v to 5.5 v 0.01 f adr0 c1 dgnd a1 10 k 10 k 10 k v+
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com typical application (continued) 9.2.1.1 design requirements for this application, the system must operate over the environment described in table 8 . table 8. wide-range parameters design parameter example value comment n 32 number of devices in calibration set minimum t die 0 c minimum expected die temperature maximum t die 60 c maximum expected die temperature minimum t obj 0 c minimum expected objected temperature maximum t obj 60 c maximum expected object temperature 0.95 object emissivity field of view 110 field of view subtended by object conversion rate 1 sample/second select a set of values for t die and t obj to generate the calibration set. at a minimum, include the four extreme points of the temperature ranges desired. in practice, it is best to include a number of intermediate points as well. this example uses the values shown in table 9 , with an x marking the values chosen for measurement. table 9. wide-range measurement values t die t obj 0 c 20 c 40 c 60 c 0 c x x x x 20 c x x x x 40 c x x x x 60 c x x x x 9.2.1.2 detailed design procedure before attempting to calibrate the system, it is necessary to establish the stability of the system. noise is a measure of precision, which is the random deviation from the mean of the distribution. for a gaussian (or normal) distribution, the precision is typically characterized by the standard deviation (sensor noise), . 9.2.1.2.1 wide-range calibration to begin calibration, select an object temperature (t obj ) and a value for the die temperature (t die ). with these system temperatures stable, take a statistically significant number of samples of v sensor (results shown in register 00h). in this example, 64 samples were taken. to compensate for first order drift in system temperatures, it is often useful to normalize the data set. for this purpose, for each temperature set, the sensor voltage data (given in register 00h) is normalized by first finding the best fit line of the form shown in equation 9 : (9) the normalized data for each data set is then calculated as shown in equation 10 : (10) the normalized data, v sensor_norm , is centered on zero mean, and is first-order corrected for long-term drift. the standard deviation for each data set is then calculated to estimate the sensor noise, . verify that the data are limited by white noise and no other effects. for a sensor-noise-limited data set, v sensor is typically < 1 v, and preferably < 0.5 v after first-order correction for drift, as described previously. if this condition is not satisfied, then the calibration accuracy is limited by external system factors (for example, convection or conduction). repeat this process for each combination of t obj and t die for which the calibration is to be performed. the normalized data are used only for evaluating the suitability of the data set for calibration, and not for the actual calibration itself. 22 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B ( ) norm meas sensor (mv) sensor a sampleno b = - + sensor (mv) a sampleno b = +
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 for calibration, the mean value, < v sensor > , is calculated for each combination of t obj and t die , as shown in table 10 . using the mean value minimizes error introduced by random noise. based on the means, a set of coefficients is generated based on a user-selected optimization criteria for equation 7 . common criteria are minimizing the maximum error, minimizing the average error, and so on. for a detailed discussion of optimization methods, see user guide sbou142, tmp007 calibration guide . table 10. mean values t die t obj 0 c 20 c 40 c 60 c 0 c < v sensor > < v sensor > < v sensor > < v sensor > 20 c < v sensor > < v sensor > < v sensor > < v sensor > 40 c < v sensor > < v sensor > < v sensor > < v sensor > 60 c < v sensor > < v sensor > < v sensor > < v sensor > 9.2.1.2.2 verifying the calibration the next step is to use the generated coefficients to verify the calibration, and determine the accuracy of the system. for common calibration (c) , the same coefficients are used for all devices; in unit calibration (u) the coefficients are calculated for each device. common calibration includes device-to-device variation, and thus is less accurate, but much easier to implement. unit calibration is more accurate, and eliminates device variation, but requires more effort to implement. the choice depends on the application requirements for accuracy versus implementation effort. mean calibration error at each point is defined as shown in equation 11 : where ? t obj_predict is the temperature based on the calibration coefficients. ? t obj_actual is the known object temperature, measured independently. ? n is the number of devices in the calibration set. (11) the mean error graph (see figure 20 ) provides an efficient method of understanding how the systematic errors vary across the temperature ranges of interest. this graph also provides a means of weighing the benefits and efforts of common versus unit calibration for a particular application. note that calibration does not affect the temporal random noise observed, as shown in figure 21 . the standard deviation of the temperature error is independent of the calibration if the random error is dominated by the sensor noise and not external system factors, such as convection and conduction. for common calibration, the total standard deviation increases because of the effects of device-to-device variation. this standard deviation is calculated in the usual way, by substituting t obj_predict for the mean in the standard deviation formula. the accuracy is then defined as the mean calibration error plus the random errors from all sources. for this example application, use the criteria shown in equation 12 : (12) copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 23 product folder links: tmp006 TMP006B accuracy mean calibration error 3 standard deviations = ( ) n mean obj_predict obj_actual 1 1 e t t n = - ?
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com 9.2.1.3 application curves figure 20. mean calibration error, wide range over t die figure 21. noise in temperature measurement, wide range over t die 9.3 system examples 9.3.1 use of nep, netd, and responsivity in estimating system performance it is often necessary to estimate system performance as part of the design process. a key system parameter is temperature accuracy for a given set of parameters. table 11 lists example parameters for estimating system performance. table 11. estimating system performance parameters design parameter example value comment object distance 10 mm distance to object object diameter 15 mm object size and geometry 0.95 object emissivity t die 23 c die temperature t obj 30 c maximum expected object temperature fov 110 field of view subtended by object responsivity (r 0 ) 10.8 v/w responsivity for t die = 25 c, = 0 responsivity (r) 9 v/w responsivity for 110 fov sensor rms noise 0.20 v rms sensor noise at t die = 25 c nep 30 nw thermal power equivalent to rms sensor noise conversion rate 1 sps sps = samples per second the system accuracy is a function of t obj , t die , , and radiation transfer. the radiation transfer factor is system dependent, and is affected by the object distance and geometry (for example, planar versus curved surfaces, or presence of lenses). for an planar object perpendicular to the detector axis (see figure 7 ), the radiation transfer follows the well-known sin 2 ( ) result. this expression can be used with a radiation transfer function responsivity value of 9 v/w to estimate system performance. because of the angular dependence of the tmp006 and TMP006B detector response, a more accurate representation for the same radiative transfer function geometry is shown in equation 13 : where ? r 0 is the responsivity of the detector to a point source at an angle normal to the detector ( = 0 in figure 7 . r 0 has a value of ~10.8 v/w at 25 c. (13) the responsivity value of 9 v/w is based on a system with a 110 fov. 24 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B 3 0 2 1 cos r 3 t -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 0 10 20 30 40 50 60 70 80 t obj mean error ( ? c) object temperature ( ? c) 0c-c 20c-c 40c-c 60c-c 0c-u 20c-u 40c-u 60c-u c015 0.00 0.05 0.10 0.15 0.20 0.25 0 10 20 30 40 50 60 70 80 t obj rms error 1 1 ( ? c) object temperature ( ? c) 0c-c 20c-c 40c-c 60c-c 0c-u 20c-u 40c-u 60c-u c016
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 using the device-specific radiation transfer expression and r0, the detector response is shown in equation 14 : where ? obj is the emissivity of the object (0.95). ? b is the stefan-boltzmann constant (5.67 10 -12 w/cm 2 /k 4 ). ? t obj is the object temperature (273 k + 30 c). ? t die is the detector temperature (273 k + 23 c). ? a det is the detector active area (1.09 10 -3 cm 2 ) ? is the half-angle subtended by the object as viewed from the detector. ? r 0 is the responsivity (~10.8 v/w for the specified temperatures). (14) the value of cos is shown in equation 15 : where ? r is the distance between the detector and the object (10 mm). ? d is the diameter of the object (15 mm). (15) differentiating with respect to object temperature, a small change in temperature creates a small change in the measured voltage given by equation 16 : (16) substituting values for the parameters yields equation 17 : (17) the sensor rms noise at t die = 25 c is ~0.25 v; thus, the rms variation in temperature measurement is as shown in equation 18 : (18) the peak-to-peak noise is approximately six times the rms noise; therefore, estimate an accuracy of approximately 0.33 c. this estimate can also be made using the noise-equivalent power (nep), noting that nep is the ratio of noise to responsivity, as shown in equation 19 : (19) assuming the system is sensor-noise limited, the nep is ~30 nw at 25 c, as shown in equation 20 : (20) again, the peak-to-peak noise is approximately 6x the rms noise; therefore estimate an accuracy of approximately 0.42 c. the different results from these two techniques is because of estimated values used for some parameters. the purpose of these techniques is not to obtain exact answers, but rather to quickly estimate the feasibility of a system implementation based on basic system parameters. these examples are intended only as guidelines; the specific values for the parameters depend on the specific system details. copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 25 product folder links: tmp006 TMP006B obj 30 nw t 140 mk 213 nw/k ' | 3 3 out 8 obj b obj det obj obj 3 0 v nw nep t a 1 cos t 213 t r k h v t ' ' ' ? ? 1 . rms noise obj out sensor 0.25 9 t 110 mk v 2 3 9. ' | ' . sensor obj 9 v 2 3 t k ' u cos 3 3 8 out obj b obj det 0 obj 3 v t a 1 r t h v t ' ' . 2 2 2r cos 0 800 4r d t 4 4 3 sensor obj b obj die det 0 2 v = t t a (1 cos )r 3 h v t
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com 10 power-supply recommendations the tmp006 and TMP006B are designed to operate with a power supply voltage (v s ) of between 2.5 v and 5.5 v. this input supply must be well regulated. the die temperature measurement (t die ) dependence on supply voltage is typically 20 m c/v for t die > 0 c. the power-on reset (por) has a nominal value of 1.9 v at t die = 25 c. the por increases with decreasing die temperature. place the decoupling capacitor (0.01 f recommended) as close as possible to the device without obstructing the field of view. 26 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 11 layout 11.1 layout guidelines the ir thermopile sensor in the tmp006 and TMP006B is as susceptible to conducted and radiant ir energy from below the sensor on the pcb as it is to the ir energy from objects in its forward-looking field of view. when the area of pcb below the tmp006 or TMP006B is at the same temperature as the die or substrate of the tmp006 or TMP006B, heat is not transferred between the ir sensor and the pcb. however, temperature changes on a closely-placed target object or other events that lead to changes in system temperature can cause the pcb temperature and the tmp006 or TMP006B temperature to drift apart from each other. this drift in temperatures can cause a heat transfer between the ir sensor and the pcb to occur. because of the small distance between the pcb and the bottom of the sensor, this heat energy will be conducted (as opposed to radiated) through the thin layer of air between the ir sensor and the pcb below it. this heat conduction causes offsets in the ir sensor voltage readings and ultimately leads to temperature calculation errors. to prevent and minimize these errors, the tmp006 and TMP006B layouts must address critical factors: thermally isolate the tmp006 and TMP006B from the rest of the pcb and any heat sources on it. provide a stable thermal environment to reduce the noise in the measurement readings figure 22 illustrates the concept of thermally isolating the tmp006 and TMP006B from the pcb and external heat sources such as other components, air currents, and so on. figure 22. principle of tmp006 and TMP006B thermal isolation copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 27 product folder links: tmp006 TMP006B field of view target object pcb copper groundempty fr-4 material tmp006 ir sensor k sensor_pcb k tmp006 electrically connected thermally isolated k board
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com 11.2 layout examples for more detailed information, refer to sbou108 ? tmp006 layout and assembly guidelines . figure 23. top layer 28 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 layout examples (continued) figure 24. enlarged view use a 12-mil pad and 15-mil solder balls for a1, a2, a3, b1, b3, c1, c2 and c3. copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 29 product folder links: tmp006 TMP006B copper fill 15mil15mil pad spacing 20mil b1 a1 a2 a3 b3 c3 c2 c1
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com layout examples (continued) figure 25. bottom layer 30 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B
tmp006 , TMP006B www.ti.com sbos518e ? may 2011 ? revised april 2015 12 device and documentation support 12.1 device support 12.1.1 device nomenclature the device performance is characterized by the signal, responsivity, and the noise of the sensor. the sensor noise can be characterized in terms of the raw sensor voltage, or in terms of a reference system with known optical transfer function. responsivity a measure of the voltage generated by the thermopile as a function of the thermal radiation incident on the device. the responsivity is measured in v/w. typically incident radiations are in w and sensor output voltages in v. sensor noise the noise voltage intrinsic to the sensor given in nv. this parameter is conversion-time dependent. noise equivalent power (nep) the smallest thermal power difference that the detector can reliably detect; measured in nw. the nep is a function of the sensor noise and the responsivity. noise equivalent temperature difference (netd) the smallest temperature difference the detector can reliably detect; measured in millikelvins (mk). the netd is a function of the sensor noise, responsivity and the system specific optical path. for comparison purposes, netd is given for a reference system without a lens and with an ideal (nonabsorbing) f/1 lens. 12.2 documentation support 12.2.1 related documentation tmp007 calibration guide , sbou142 . tmp006 layout and assembly guidelines , sbou108 . 12.3 related links table 12 lists quick access links. categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. table 12. related links technical tools & support & parts product folder sample & buy documents software community tmp006 click here click here click here click here click here TMP006B click here click here click here click here click here 12.4 trademarks all trademarks are the property of their respective owners. 12.5 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.6 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. copyright ? 2011 ? 2015, texas instruments incorporated submit documentation feedback 31 product folder links: tmp006 TMP006B
tmp006 , TMP006B sbos518e ? may 2011 ? revised april 2015 www.ti.com 13 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. 32 submit documentation feedback copyright ? 2011 ? 2015, texas instruments incorporated product folder links: tmp006 TMP006B
package option addendum www.ti.com 17-jan-2015 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples tmp006aiyzfr active dsbga yzf 8 3000 green (rohs & no sb/br) snagcu level-2-260c-1 year -40 to 125 tmp006 tmp006aiyzft active dsbga yzf 8 250 green (rohs & no sb/br) snagcu level-2-260c-1 year -40 to 125 tmp006 TMP006Biyzfr active dsbga yzf 8 3000 green (rohs & no sb/br) snagcu level-2-260c-1 year -40 to 125 t006b TMP006Biyzft active dsbga yzf 8 250 green (rohs & no sb/br) snagcu level-2-260c-1 year -40 to 125 t006b (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width.
package option addendum www.ti.com 17-jan-2015 addendum-page 2 important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant tmp006aiyzfr dsbga yzf 8 3000 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 tmp006aiyzft dsbga yzf 8 250 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 TMP006Biyzfr dsbga yzf 8 3000 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 TMP006Biyzft dsbga yzf 8 250 180.0 8.4 1.65 1.65 0.81 4.0 8.0 q1 package materials information www.ti.com 17-jun-2015 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) tmp006aiyzfr dsbga yzf 8 3000 182.0 182.0 20.0 tmp006aiyzft dsbga yzf 8 250 182.0 182.0 20.0 TMP006Biyzfr dsbga yzf 8 3000 182.0 182.0 20.0 TMP006Biyzft dsbga yzf 8 250 182.0 182.0 20.0 package materials information www.ti.com 17-jun-2015 pack materials-page 2
d: max = e: max = 1.565 mm, min = 1.565 mm, min = 1.504 mm1.504 mm
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